Sunday, October 9, 2011

The new iPhone 5 specs

Gathering information from several relevant sources, here is what is expected from the new iPhone5.
  • will use new models of a wireless baseband chip developed by Qualcomm, that will enable use on both GSM and CDMA networks (instead of the Infineon chips used by the iPhone 4)
  • some say that iPhone 5 may have a curved glass screen
  • the iPhone 5 will be both lighter and thinner than the iPhone 4.
  • it may use a smaller SIM card rather than using an electronic SIM, as a way to make it thinner. This new SIM standard would be even smaller than the “micro SIM” currently used by the iPhone 4.
The french website Nowhereelse.fr created an interesting info-graphic about the new iPhone 5 specs
  • Design similar or not to the iPhone 4
    There are contradictory rumors from ThisIsMyNext (that claimed that the iPhone 5 would be a radical design departure from the iPhone 4) and Wall Street Journal (which recent reports doesn’t indicate any change in design)
  • possibly a 3D camera
    Apple filed a patent application related to 3D picture taking to the US Patent and Trademark Office in March of 2011. It described a system for capturing, processing and rendering 3D images with additional dual-camera hardware and some in May, an iPhone 5 News Blog report, indicated a dual camera sensor array on the next version of iPhone.
  • FaceTime HD Camera
  • Invisible Sensors
  • 4-inch display and 0.28-inch thickness
  • 8-megapixel camera with full HD 1080p video recording
  • new antenna locations
  • black and white new iPhone 5 versions
  • at least a dual-core A5 processor, 16GB/32GB support
    iOS 5 ready