Sunday, October 9, 2011

The new iPhone 5 specs

Gathering information from several relevant sources, here is what is expected from the new iPhone5.
  • will use new models of a wireless baseband chip developed by Qualcomm, that will enable use on both GSM and CDMA networks (instead of the Infineon chips used by the iPhone 4)
  • some say that iPhone 5 may have a curved glass screen
  • the iPhone 5 will be both lighter and thinner than the iPhone 4.
  • it may use a smaller SIM card rather than using an electronic SIM, as a way to make it thinner. This new SIM standard would be even smaller than the “micro SIM” currently used by the iPhone 4.
The french website created an interesting info-graphic about the new iPhone 5 specs
  • Design similar or not to the iPhone 4
    There are contradictory rumors from ThisIsMyNext (that claimed that the iPhone 5 would be a radical design departure from the iPhone 4) and Wall Street Journal (which recent reports doesn’t indicate any change in design)
  • possibly a 3D camera
    Apple filed a patent application related to 3D picture taking to the US Patent and Trademark Office in March of 2011. It described a system for capturing, processing and rendering 3D images with additional dual-camera hardware and some in May, an iPhone 5 News Blog report, indicated a dual camera sensor array on the next version of iPhone.
  • FaceTime HD Camera
  • Invisible Sensors
  • 4-inch display and 0.28-inch thickness
  • 8-megapixel camera with full HD 1080p video recording
  • new antenna locations
  • black and white new iPhone 5 versions
  • at least a dual-core A5 processor, 16GB/32GB support
    iOS 5 ready